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  Interfacial fracture toughness of sintered hybrid silver interconnects

Wang, S., Kirchlechner, C., Keer, L., Dehm, G., & Yao, Y. (2020). Interfacial fracture toughness of sintered hybrid silver interconnects. Journal of Materials Science, 55(7), 2891-2904. doi:10.1007/s10853-019-04212-1.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0005-886E-7 Version Permalink: http://hdl.handle.net/21.11116/0000-0005-886F-6
Genre: Journal Article

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 Creators:
Wang, Shaobin1, Author              
Kirchlechner, Christoph2, Author              
Keer, Leon3, Author              
Dehm, Gerhard4, Author              
Yao, Yao1, 4, Author              
Affiliations:
1School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China, ou_persistent22              
2Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
3Department of Civil and Environmental Engineering, Northwestern University, 2145 Sheridan Rd, Evanston, IL, 60208, USA, ou_persistent22              
4Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2019-12-012020
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: DOI: 10.1007/s10853-019-04212-1
 Degree: -

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Title: Journal of Materials Science
  Abbreviation : J. Mater. Sci.
Source Genre: Journal
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Publ. Info: -
Pages: - Volume / Issue: 55 (7) Sequence Number: - Start / End Page: 2891 - 2904 Identifier: ISSN: 0022-2461
CoNE: https://pure.mpg.de/cone/journals/resource/954925415936_1