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  DAMASK: The Düsseldorf Advanced Materials Simulation Kit

Diehl, M., Cereceda, D., Marian, J., Liu, C., Dong, J., Wicke, M., et al. (2019). DAMASK: The Düsseldorf Advanced Materials Simulation Kit. Talk presented at Seminar of the Department of Materials Science and Engineering of the Ohio State University. Columbus, OH, USA. 2019-08-26.

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 Creators:
Diehl, Martin1, 2, Author           
Cereceda, David3, Author           
Marian, Jaime4, Author           
Liu, Chuanlai1, Author           
Dong, J., Author
Wicke, Marcel5, Author           
Brückner-Foit, Angelika5, Author
Kamachali, Reza Darvishi1, Author           
Shanthraj, Pratheek1, Author           
Roters, Franz1, Author           
Eisenlohr, Philip6, Author           
Raabe, Dierk7, Author           
Affiliations:
1Theory and Simulation, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863392              
2Integrated Computational Materials Engineering, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3069168              
3Villanova University, Villanova, PA, USA, ou_persistent22              
4Materials Science and Engineering Department, University of California, Los Angeles, CA, USA, ou_persistent22              
5Institute for Materials Engineering, University of Kassel, Moenchebergstraße 3, Kassel, Germany, ou_persistent22              
6Michigan State University, Chemical Engineering and Materials Science, East Lansing, MI 48824, USA, ou_persistent22              
7Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863381              

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Language(s): eng - English
 Dates: 2019-08-26
 Publication Status: Not specified
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: -
 Degree: -

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Title: Seminar of the Department of Materials Science and Engineering of the Ohio State University
Place of Event: Columbus, OH, USA
Start-/End Date: 2019-08-26
Invited: Yes

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