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  Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

Phua, E. J. R., Liu, M., Cho, B., Liu, Q., Amini, S., Hu, X., et al. (2018). Novel high temperature polymeric encapsulation material for extreme environment electronics packaging. Materials & Design, 141, 202-209. doi:10.1016/j.matdes.2017.12.029.

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Item Permalink: http://hdl.handle.net/21.11116/0000-0005-FD74-C Version Permalink: http://hdl.handle.net/21.11116/0000-0005-FD75-B
Genre: Journal Article

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 Creators:
Phua, Eric Jian Rong, Author
Liu, Ming, Author
Cho, Bokun, Author
Liu, Qing, Author
Amini, Shahrouz1, Author              
Hu, Xiao, Author
Gan, Chee Lip, Author
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1External Organizations, ou_persistent22              

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 Dates: 2018-03-05
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Degree: -

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Title: Materials & Design
Source Genre: Journal
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Publ. Info: Elsevier Ltd.
Pages: - Volume / Issue: 141 Sequence Number: - Start / End Page: 202 - 209 Identifier: ISSN: 0264-1275