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  Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique

Deng, T., Xing, T., Brod, M. K., Sheng, Y., Qiu, P., Veremchuk, I., et al. (2020). Discovery of high-performance thermoelectric copper chalcogenide using modified diffusion-couple high-throughput synthesis and automated histogram analysis technique. Energy & Environmental Science, 13(9), 3041-3053. doi:10.1039/d0ee02209h.

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 Creators:
Deng, Tingting1, Author
Xing, Tong1, Author
Brod, Madison K.1, Author
Sheng, Ye1, Author
Qiu, Pengfei1, Author
Veremchuk, Igor1, Author
Song, Qingfeng1, Author
Wei, Tian-Ran1, Author
Yang, Jiong1, Author
Snyder, G. Jeffrey1, Author
Grin, Yuri2, Author              
Chen, Lidong1, Author
Shi, Xun1, Author
Affiliations:
1External Organizations, ou_persistent22              
2Juri Grin, Chemical Metal Science, Max Planck Institute for Chemical Physics of Solids, Max Planck Society, ou_1863413              

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 Abstract: Discovery of novel high-performance materials with earth-abundant and environmentally friendly elements is a key task for civil applications based on advanced thermoelectric technology. Advancements in this area are greatly limited by the traditional trial-and-error method, which is both time-consuming and expensive. The materials genome initiative can provide a powerful strategy to screen for potential novel materials using high-throughput calculations, materials characterization, and synthesis. In this study, we developed a modified diffusion-couple high-throughput synthesis method and an automated histogram analysis technique to quickly screen high-performance copper chalcogenide thermoelectric materials, which has been well demonstrated in the ternary Cu-Sn-S compounds. A new copper chalcogenide with the composition of Cu(7)Sn(3)S(10)was discovered. Studies on crystal structure, band gap, and electrical and thermal transport properties were performed to show that it is a promising thermoelectric material with ultralow lattice thermal conductivity, moderate band gap, and decent electrical conductivity.ViaCl doping, the thermoelectric dimensionless figure of meritzTreaches 0.8 at 750 K, being among the highest values reported in Cu-Sn-S ternary materials. The modified diffusion-couple high-throughput synthesis method and automated histogram analysis technique developed in this study also shed light on the development of other advanced thermoelectric and functional materials.

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Language(s): eng - English
 Dates: 2020-07-302020-07-30
 Publication Status: Published in print
 Pages: -
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 Table of Contents: -
 Rev. Type: -
 Identifiers: ISI: 000570224500023
DOI: 10.1039/d0ee02209h
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Title: Energy & Environmental Science
  Abbreviation : Energy Environ. Sci.
Source Genre: Journal
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Publ. Info: Cambridge, UK : Royal Society of Chemistry
Pages: - Volume / Issue: 13 (9) Sequence Number: - Start / End Page: 3041 - 3053 Identifier: ISSN: 1754-5692
CoNE: https://pure.mpg.de/cone/journals/resource/1754-5692