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  Back-side-on-BOX heterogeneous laser integration for fully integrated photonic circuits on silicon

Menezo, S., Thiessen, T., El-Zammer, G., Mak, J., Da Fonesca, J., Brianceau, P., et al. (2019). Back-side-on-BOX heterogeneous laser integration for fully integrated photonic circuits on silicon. In 45th European Conference on Optical Communication (ECOC 2019). doi:10.1049/cp.2019.0826.

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09125554.pdf (Publisher version), 467KB
 
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 Creators:
Menezo, Sylvie1, Author
Thiessen, Torrey1, Author
El-Zammer, Georgio1, Author
Mak, Jason2, Author
Da Fonesca, Jérémy1, Author
Brianceau , Pierre1, Author
Szelag, Bertrand1, Author
Jany, Christophe1, Author
Poon, Joyce3, Author              
Affiliations:
1External Organizations, ou_persistent22              
2Max Planck Institute of Microstructure Physics, Max Planck Society, Weinberg 2, 06120 Halle, DE, ou_2415691              
3Nanophotonics, Integration, and Neural Technology, Max Planck Institute of Microstructure Physics, Max Planck Society, ou_3287471              

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 Abstract: We present a fabrication flow integrating lasers at the backside of silicon-on-insulator wafers. It is expected to be compatible with integration of other material-layers and reduce the variance of lasers performance. A DFB laser fabricated accordingly exhibits a total waveguide-coupled power of 60mW at 160mA/20°C

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Language(s): eng - English
 Dates: 2019-09-22
 Publication Status: Published online
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 Identifiers: DOI: 10.1049/cp.2019.0826
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Title: 45th European Conference on Optical Communication (ECOC 2019)
Place of Event: Dublin, Ireland
Start-/End Date: 2019-09-22 - 2019-09-26

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Title: 45th European Conference on Optical Communication (ECOC 2019)
Source Genre: Proceedings
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Pages: - Volume / Issue: - Sequence Number: - Start / End Page: - Identifier: ISBN: 978-1-83953-185-9