Atomistic simulation study of grain boundary migration for different 
complexions in copper

Pemma, Swetha; Janisch, Rebecca; Dehm, Gerhard; Brink, Tobias

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Atomistic simulation study of grain boundary migration for different complexions in copper

Pemma, S., Janisch, R., Dehm, G., & Brink, T. (2021). Atomistic simulation study of grain boundary migration for different complexions in copper. Talk presented at DPG-Tagung, Virtual. 2021-09-27 - 2021-10-01.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0009-5BDB-B Version Permalink: https://hdl.handle.net/21.11116/0000-0009-5BDC-A

Genre: Talk

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Creators:
Pemma, Swetha¹, Author
Janisch, Rebecca², Author
Dehm, Gerhard³, Author
Brink, Tobias¹, Author

Affiliations:
1Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3291845
2Mechanical Properties of interfaces Department of Micromechanical and Macroscopic Modelling, ICAMS, Ruhr-Universität Bochum, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2021-09-27

Publication Status: Not specified

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Title: DPG-Tagung, Virtual

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Start-/End Date: 2021-09-27 - 2021-10-01

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