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  Microstructure and residual stress evolution in nanocrystalline Cu–Zr thin films

Chakraborty, J., Oellers, T., Raghavan, R., Ludwig, A., & Dehm, G. (2022). Microstructure and residual stress evolution in nanocrystalline Cu–Zr thin films. Journal of Alloys and Compounds, 896: 162799. doi:10.1016/j.jallcom.2021.162799.

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Published Cu-Zr article-JALCOM-2021.pdf (Supplementary material), 8MB
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Published Cu-Zr article-JALCOM-2021.pdf
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2021
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Published by Elsevier B.V.
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Chakraborty, Jay1, Author
Oellers, Tobias2, Author              
Raghavan, Rejin3, Author              
Ludwig, Alfred4, Author              
Dehm, Gerhard5, Author              
Affiliations:
1Materials Engineering Division, National Metallurgical Laboratory, Council of Scientific and Industrial Research, P.O. Burmamines, Jamshedpur 831007, India, ou_persistent22              
2Institute for Materials, Ruhr-Universität Bochum, 44801 Bochum, Germany, ou_persistent22              
3Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India, ou_persistent22              
4Materials Discovery and Interfaces, Institut für Werkstoffe, Ruhr-Universität Bochum, Germany, ou_persistent22              
5Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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 Abstract: Grazing incidence X-ray diffraction (GIXRD) and scanning transmission electron microscopy (STEM) combined with energy dispersive X-ray spectroscopy (EDS) were employed to study the microstructure evolution and stress development in the nanocrystalline Cu100−X-ZrX (2.5 at ≤ x ≤ 5.5 at) alloy thin films. Small Zr additions to Cu led to significant lattice parameter anisotropy in the as-deposited Cu-Zr thin films both due to macroscopic lattice strain and stacking faults in the Cu matrix. Strain free lattice parameters obtained after the XRD stress analysis of Cu-Zr thin films confirmed formation of a supersaturated substitutional Cu-Zr solid solution. For the first time, the study of film microstructure by XRD line profile analysis (XLPA) confirmed progressive generation of dislocations and planar faults with increasing Zr composition in Cu-Zr alloy films. These microstructural changes led to the generation of tensile stresses in the thin films along with considerable stress gradients across the films thicknesses which are quantified by the traditional dψhkl−Sin2ψ and GIXRD stress measurement methods. The origin of tensile stresses and stress gradients in the Cu-Zr film are discussed on the basis of film growth and heterogeneous microstructure with changing Zr composition. © 2021

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Language(s): eng - English
 Dates: 2022-03-10
 Publication Status: Published in print
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 Identifiers: DOI: 10.1016/j.jallcom.2021.162799
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Title: Journal of Alloys and Compounds
  Abbreviation : J. Alloy. Comp.
Source Genre: Journal
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Publ. Info: Lausanne, Switzerland : Elsevier B.V.
Pages: - Volume / Issue: 896 Sequence Number: 162799 Start / End Page: - Identifier: ISSN: 0925-8388
CoNE: https://pure.mpg.de/cone/journals/resource/954925567746