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  Size scaling in bi-crystalline Cu micropillars containing a coherent twin boundary

Hosseinabadi, R., Riesch-Oppermann, H., Best, J. P., Dehm, G., & Kirchlechner, C. (2022). Size scaling in bi-crystalline Cu micropillars containing a coherent twin boundary. Acta Materialia, 230: 117841. doi:10.1016/j.actamat.2022.117841.

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1-s2.0-S1359645422002270-main.pdf (Publisher version), 2MB
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1-s2.0-S1359645422002270-main.pdf
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2022
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The Authors. Published by Elsevier Ltd on behalf of Acta Materialia Inc.

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 Creators:
Hosseinabadi, Reza1, Author              
Riesch-Oppermann, Heinz2, Author
Best, James P.1, Author              
Dehm, Gerhard3, Author              
Kirchlechner, Christoph1, 2, Author              
Affiliations:
1Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
2Institute for Applied Materials (IAM-WBM), Karlsruhe Institute of Technology (KIT), Eggenstein-Leopoldshafen D-76344, Germany, ou_persistent22              
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2022-05-15
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1016/j.actamat.2022.117841
 Degree: -

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Title: Acta Materialia
  Abbreviation : Acta Mater.
Source Genre: Journal
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Publ. Info: -
Pages: 8 Volume / Issue: 230 Sequence Number: 117841 Start / End Page: - Identifier: ISSN: 1359-6454
CoNE: https://pure.mpg.de/cone/journals/resource/954928603100