Investigation of Electromigration in Cu Interconnects by Noise Measurements

Emelianov, V.; Ganesam, G.; Puzic, A.; Schulz, S.; Habermeier, H.-U.; Stoll, H.

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Investigation of Electromigration in Cu Interconnects by Noise Measurements

Emelianov, V., Ganesam, G., Puzic, A., Schulz, S., Habermeier, H.-U., & Stoll, H. (2003). Investigation of Electromigration in Cu Interconnects by Noise Measurements. Proceedings of SPIE, 5112, 271-281.

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Item Permalink: https://hdl.handle.net/21.11116/0000-000E-E84F-5 Version Permalink: https://hdl.handle.net/21.11116/0000-000E-E850-2

Genre: Journal Article

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Creators:
Emelianov, V., Author
Ganesam, G., Author
Puzic, A., Author
Schulz, S., Author
Habermeier, H.-U.^{1, 2, 3}, Author
Stoll, H., Author

Affiliations:
1Scientific Facility Thin Film Technology (Gennady Logvenov), Max Planck Institute for Solid State Research, Max Planck Society, ou_3370497
2Department Solid State Spectroscopy (Bernhard Keimer), Max Planck Institute for Solid State Research, Max Planck Society, ou_3370480
3Department Physical Chemistry of Solids (Joachim Maier), Max Planck Institute for Solid State Research, Max Planck Society, ou_3370483

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Language(s): eng - English

Dates: Date issued: 2003

Publication Status: Issued

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Identifiers: eDoc: 199109

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Title: Proceedings of SPIE

Source Genre: Journal

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Pages: - Volume / Issue: 5112 Sequence Number: - Start / End Page: 271 - 281 Identifier: -