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Title:
TEI '23
Subtitle
:
Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction
Abbreviation
:
TEI 2023
Other
:
TEI'23
Source Genre:
Proceedings
Creator(s):
Affiliations:
Publ. Info:
New York, NY : ACM
Pages:
-
Volume / Issue:
-
Sequence Number:
68
Start / End Page:
1 - 5
Identifier:
ISBN: 978-1-4503-9977-7