English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
 
 
DownloadE-Mail
 Local TagsRelease HistoryDetailsSummary
  Ohmic Electron Injection into Organic Semiconductors by Solution‐Processed and Evaporated Organic Interlayers

Trieb, D., Blom, P. W. M., & Wetzelaer, G.-J. (2023). Ohmic Electron Injection into Organic Semiconductors by Solution‐Processed and Evaporated Organic Interlayers. Advanced Materials Interfaces, 10(19): 2202424. doi:10.1002/admi.202202424.

Item is

 

show all hide all

Basic

show hide
Item Permalink: https://hdl.handle.net/21.11116/0000-000C-E79E-E Version Permalink: https://hdl.handle.net/21.11116/0000-000D-84AC-C
Genre: Journal Article

Files

show Files
hide Files
:
Adv Materials Inter - 2023 - Trieb.pdf (Publisher version), 850KB
View   Save
File Permalink:
https://hdl.handle.net/21.11116/0000-000D-84AD-B
Name:
Adv Materials Inter - 2023 - Trieb.pdf
Description:
-
OA-Status:
Not specified
Visibility:
Public
MIME-Type / Checksum:
application/pdf / [MD5]
Technical Metadata:
View
Copyright Date:
2023
Copyright Info:
The Authors
License:
https://creativecommons.org/licenses/by/4.0/

Locators

show

Creators

show
hide
 Creators:
Trieb, David1, Author           
Blom, Paul W. M.1, Author           
Wetzelaer, Gert-Jan1, Author           
Affiliations:
1Dept. Blom: Molecular Electronics, MPI for Polymer Research, Max Planck Society, ou_1800284              

Content

show

Details

show
hide
Language(s): eng - English
 Dates: 2023-07-06
 Publication Status: Published online
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: -
 Identifiers: DOI: 10.1002/admi.202202424
 Degree: -

Event

show

Legal Case

show

Project information

show

Source 1

show
hide
Title: Advanced Materials Interfaces
  Abbreviation : Adv. Mater. Interfaces
Source Genre: Journal
 Creator(s):
Affiliations:
Publ. Info: Weinheim : Wiley-VCH
Pages: - Volume / Issue: 10 (19) Sequence Number: 2202424 Start / End Page: - Identifier: ISSN: 2196-7350
CoNE: https://pure.mpg.de/cone/journals/resource/2196-7350