Grain-boundary segregation effects on bicrystal Cu pillar compression

Brink, Tobias; Bhat, Mohammed Kamran; Best, James P.; Dehm, Gerhard

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Grain-boundary segregation effects on bicrystal Cu pillar compression

Brink, T., Bhat, M. K., Best, J. P., & Dehm, G. (2023). Grain-boundary segregation effects on bicrystal Cu pillar compression. Talk presented at DPG Spring Meeting. Dresden, Germany. 2023-03-26 - 2023-03-31.

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Item Permalink: https://hdl.handle.net/21.11116/0000-000D-0F52-7 Version Permalink: https://hdl.handle.net/21.11116/0000-000D-0F53-6

Genre: Talk

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Creators:
Brink, Tobias¹, Author
Bhat, Mohammed Kamran², Author
Best, James P.², Author
Dehm, Gerhard³, Author

Affiliations:
1Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3291845
2Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2023-03

Publication Status: Not specified

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Title: DPG Spring Meeting

Place of Event: Dresden, Germany

Start-/End Date: 2023-03-26 - 2023-03-31

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