Disconnection activation in complexions of a Cu grain boundary under shear

Pemma, Swetha; Janisch, Rebecca; Dehm, Gerhard; Brink, Tobias

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Disconnection activation in complexions of a Cu grain boundary under shear

Pemma, S., Janisch, R., Dehm, G., & Brink, T. (2023). Disconnection activation in complexions of a Cu grain boundary under shear. Talk presented at 19th International Conference on Diffusion in Solids and Liquids (DSL-2023). Heraklion, Greece. 2023-06-26 - 2023-06-30.

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Item Permalink: https://hdl.handle.net/21.11116/0000-000E-433A-6 Version Permalink: https://hdl.handle.net/21.11116/0000-000E-433B-5

Genre: Talk

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Creators:
Pemma, Swetha¹, Author
Janisch, Rebecca², Author
Dehm, Gerhard³, Author
Brink, Tobias¹, Author

Affiliations:
1Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3291845
2Mechanical Properties of interfaces Department of Micromechanical and Macroscopic Modelling, ICAMS, Ruhr-Universität Bochum, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

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Language(s): eng - English

Dates: Created: 2023

Publication Status: Not specified

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Title: 19th International Conference on Diffusion in Solids and Liquids (DSL-2023)

Place of Event: Heraklion, Greece

Start-/End Date: 2023-06-26 - 2023-06-30

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