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Title:
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Source Genre:
Proceedings
Creator(s):
Affiliations:
Publ. Info:
Institute of Electrical and Electronics Engineers Inc.
Pages:
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Volume / Issue:
-
Sequence Number:
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Start / End Page:
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Identifier:
ISBN: 979-835039363-7