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Damage behavior of 200-nm thin copper films under cyclic loading

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Zhang,  G. P.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert,  C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Schwaiger,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Kraft,  O.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Zhang, G. P., Volkert, C. A., Schwaiger, R., Arzt, E., & Kraft, O. (2005). Damage behavior of 200-nm thin copper films under cyclic loading. Journal of Materials Research, 20(1), 201-207.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2704-1
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