Microstructural development of Sn-Ag-Cu solder joints

Fix, A. R.; López, G. A.; Brauer, I.; Nüchter, W.; Mittemeijer, E. J.

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Microstructural development of Sn-Ag-Cu solder joints

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Fix, A. R.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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López, G. A.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mittemeijer, E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Fix, A. R., López, G. A., Brauer, I., Nüchter, W., & Mittemeijer, E. J. (2005). Microstructural development of Sn-Ag-Cu solder joints. Journal of Electronic Materials, 34, 137-142.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2763-B

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