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Microstructural development of Sn-Ag-Cu solder joints

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Fix,  A. R.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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López,  G. A.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mittemeijer,  E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Citation

Fix, A. R., López, G. A., Brauer, I., Nüchter, W., & Mittemeijer, E. J. (2005). Microstructural development of Sn-Ag-Cu solder joints. Journal of Electronic Materials, 34, 137-142.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2763-B
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