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Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect

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Spolenak,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Bravman, J. C., Spolenak, R., et al. (2004). Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect. Microelectronic Engineering, 75(1), 24-30.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2902-6
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