Unexpected mode of plastic deformation in Cu damascene lines undergoing 
electromigration

Budiman, A. S.; Tamura, N.; Valek, B. C.; Gadre, K.; Maiz, J.; Spolenak, R.; Caldwell, W. A.; Nix, W. D.; Patel, J. R.

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Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration

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Spolenak, R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Budiman, A. S., Tamura, N., Valek, B. C., Gadre, K., Maiz, J., Spolenak, R., et al. (2004). Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration. In R. Carter, C. Hau-Riege, G. Kloster, T.-M. Lu, & S. Schulz (Eds.), Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics (pp. F7.3.1-F7.3.6). Boston: MRS.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2914-D

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