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Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect

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Spolenak,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Spolenak, R., Bravman, J. C., et al. (2004). Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect. In R. Carter, C. Hau-Riege, G. Kloster, T.-M. Lu, & S. Schulz (Eds.), Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics (pp. F7.4.1-F7.4.10). Materials Research Society.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2916-9
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