Spolenak, R. Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Spolenak, R., Bravman, J. C., et al. (2004). Coupling between precipitation and plastic deformation during electromigration in a passivated Al (0.5wt%Cu) interconnect. In R. Carter, C. Hau-Riege, G. Kloster, T.-M. Lu, & S. Schulz (Eds.), Materials, Technology, Annealability for Advanced Interconnects and Low-k Dieelectrics (pp. F7.4.1-F7.4.10). Materials Research Society.