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Electromigration-induced Cu motion and precipitation in bamboo Al–Cu interconnects

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Witt,  C.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert,  C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  E.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Citation

Witt, C., Volkert, C. A., & Arzt, E. (2003). Electromigration-induced Cu motion and precipitation in bamboo Al–Cu interconnects. Acta Materialia, 51, 49-60.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-2DFE-3
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