English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT

Released

Conference Paper

Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect

MPS-Authors
/persons/resource/persons76138

Spolenak,  R.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

External Ressource
No external resources are shared
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Spolenak, R., & Patel, R. (2003). Spatially resolved characterization of electromigration-induced plastic deformation in Al(0.5wt% Cu) interconnect. In J. Pinqueras (Ed.), Spatially Resolved Characterization of Local Phenomena in Materials and Nanostructures (pp. G13.1.1-G13.1.6). Warrendale, Pa.: MRS.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2E04-B
Abstract
There is no abstract available