Spolenak, R. Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Barabash, R. I., Ice, G. E., Tamura, N., Valek, B. C., Bravman, J. C., Spolenak, R., et al. (2003). Quantitative characterization of dislocation structure coupled with electromigration in a passivated Al(0.5wt% Cu) interconnect. In A. Kerrow, J. Lelu, O. Kraft, & T. Kikkawa (Eds.), Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (pp. 107-114). Warrendale, Pa.: MRS.