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Conference Paper

Crack-tip field analyses of silicon using order (N) tight-binding method

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Gumbsch,  P.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Kugimiya, T., Shibutani, Y., & Gumbsch, P. (2001). Crack-tip field analyses of silicon using order (N) tight-binding method. In Materials Science for the 21st Century. Vol. B (pp. 285-288).


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-36BE-C
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