Creep behavior and microstructural stability of lamellar γ-TiAl (Cr, Mo, Si, B) 
with extremely fine lamellar spacing

Schillinger, W.; Zhang, D.; Dehm, G; Clemens, H.

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Creep behavior and microstructural stability of lamellar γ-TiAl (Cr, Mo, Si, B) with extremely fine lamellar spacing

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Dehm, G
Max Planck Society;

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Clemens, H.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Schillinger, W., Zhang, D., Dehm, G., & Clemens, H. (2001). Creep behavior and microstructural stability of lamellar γ-TiAl (Cr, Mo, Si, B) with extremely fine lamellar spacing. In J. H. Schneidel, K. J. Hemker, R. D. Noebe, S. Hanada, & G. Sauthoff (Eds.), High-Temperature Ordered Intermetallic Alloys IX (pp. N1.4.1.-N1.4.6.). Warrendale, PA: MRS.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-3705-F

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