Localized measurement of strains in damascene copper interconnects by 
convergent-beam electron diffraction

Nucci, J. A. R.; Keller, R.; Krämer, S.; Volkert, C. A.; Gross, M.

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Localized measurement of strains in damascene copper interconnects by convergent-beam electron diffraction

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Krämer, S.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Volkert, C. A.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Nucci, J. A. R., Keller, R., Krämer, S., Volkert, C. A., & Gross, M. (2000). Localized measurement of strains in damascene copper interconnects by convergent-beam electron diffraction. In K. Maex, Y.-C. Joo, G. S. Oehrlein, S. Ogawa, & J. T. Wetzel (Eds.), Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics (pp. D 851-D 856). Warrendale: MRS.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-38C6-6

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