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Conference Paper

Wettability effects of immersion tin final finishes with lead-free solders

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Phillipp,  F.
Stuttgart Center for Electron Microscopy, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Hetschel, T., Wolter, K.-J., & Phillipp, F. (2008). Wettability effects of immersion tin final finishes with lead-free solders. In 2nd Electronics System-Integration Technology Conference (pp. 561-566). Piscataway, NJ: IEEE.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-41C8-0
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