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Bonding at copper-alumina interfaces established by different surface treatments: a critical review

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Scheu,  C.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Gao,  M.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Oh,  S. H.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Dehm,  G.
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Klein,  S.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Tomsia,  A. P.
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Rühle,  M.
Emeriti and Others, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Scheu, C., Gao, M., Oh, S. H., Dehm, G., Klein, S., Tomsia, A. P., et al. (2006). Bonding at copper-alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science, 41(16), 5161-5168. doi:101007/s10853-006-0073-0.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0010-487E-9
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