Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: 
avoidance of whiskering

Sobiech, M.; Teufel, J.; Welzel, U.; Mittemeijer, E. J.; Hügel, W.

doi:10.1007/s11664-011-1737-3

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Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering

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Sobiech, M.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

/persons/resource/persons76192

Teufel, J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

/persons/resource/persons76284

Welzel, U.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;

/persons/resource/persons75858

Mittemeijer, E. J.
Dept. Phase Transformations; Thermodynamics and Kinetics, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Materialwissenschaft;

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Sobiech, M., Teufel, J., Welzel, U., Mittemeijer, E. J., & Hügel, W. (2011). Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on Cu: avoidance of whiskering. Journal of Electronic Materials, 40(11), 2300-2313. doi:10.1007/s11664-011-1737-3.

引用: https://hdl.handle.net/11858/00-001M-0000-0010-4E20-F

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