Electro-codeposition of Modified Silica Colloids and Copper

Kahn, Tabrisur R.; Rohwerder, Michael; Vimalanandan, Ashokanand; Erbe, Andreas; Marlow, Frank

doi:10.1524/zpch.2013.0365

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Electro-codeposition of Modified Silica Colloids and Copper

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Marlow, Frank
Research Group Marlow, Max-Planck-Institut für Kohlenforschung, Max Planck Society;

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Citation

Kahn, T. R., Rohwerder, M., Vimalanandan, A., Erbe, A., & Marlow, F. (2013). Electro-codeposition of Modified Silica Colloids and Copper. ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-INTERNATIONAL JOURNAL OF RESEARCH IN PHYSICAL CHEMISTRY & CHEMICAL PHYSICS, 227(8), 1083-1095. doi:10.1524/zpch.2013.0365.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0014-A333-E

Abstract

Copper-silica composite coatings were prepared by electro-codeposition on stainless steel substrates. The influence of functionalization and surface charge of SiO2 particles on the electrodeposition of Cu-SiO2 nanocomposite coating was studied. SiO2-SH particles were embedded inside the metal matrix whereas particles with other surface termination did not incorporate inside the metal matrix. Moreover, cysteamine addition to the electrolyte containing bare SiO2 particles induced embedding of particles into the metal matrix. The diameter-dependence of incorporation of -SH functionalized SiO2 particles as well as the role of the density of the effective functional group (-SH) for successful incorporation into Cu have been investigated. Infrared (IR) and X-ray photoelecotron (XPS) spectroscopy were used to observe the interaction of Cu2+ ions with thiol groups, showing a Cu2+ binding. The incorporated particles were found to increase the microhardness of the coating.