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Adhesion behavior of Cu–Cr thin films on polyimide substrate

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Marx,  Vera Maria
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Marx, V. M., Kirchlechner, C., Zizak, I., Cordill, M. J., & Dehm, G. (2013). Adhesion behavior of Cu–Cr thin films on polyimide substrate. Poster presented at ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0019-210A-6
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