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Micromechanical investigation of solder joints in automotive microelectronics

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Philippi,  B.
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  G.
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of solder joints in automotive microelectronics. Poster presented at GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0019-2290-0
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