Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization 
in annealing and deformation at elevated temperatures

Blum, W.; Li, Y. J.; Durst, K.

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Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures

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Li, Y. J.
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Theory and Simulation, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Blum, W., Li, Y. J., & Durst, K. (2009). Stability of ultrafine-grained Cu to subgrain coarsening and recrystallization in annealing and deformation at elevated temperatures. Acta Materialia, 57, 5207-5217.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0019-4445-0

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