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Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test

MPS-Authors
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Wapner,  K.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Stratmann,  M.
Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Grundmeier,  G.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Wapner, K., Stratmann, M., & Grundmeier, G. (2005). Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test. Poster presented at EUROMAT 2005, Prague, Czech Republic.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0019-5E99-5
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