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Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test

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Grundmeier,  G.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Wapner,  K.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Schönberger,  B.
Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Stratmann,  M.
Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Grundmeier, G., Wapner, K., Schönberger, B., & Stratmann, M. (2004). Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test. Talk presented at Annual Meeting of the American Adhesion Society. Wilmington, UK. 2004-02-15 - 2004-02-20.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0019-6614-3
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