Application of the Scanning Kelvin Probe for the study of de-adhesion processes 
at thin film engineered adhesive/metal interfaces

Wapner, K.; Grundmeier, G.

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Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces

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Wapner, K.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Grundmeier, G.
Adhesion and Thin Films, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Christian Doppler Laboratory for Metal/Polymer Interfaces, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Wapner, K., & Grundmeier, G. (2004). Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Talk presented at Annual Meeting of the American Adhesion Society. Wilmington, UK. 2004-02-15 - 2004-02-20.

引用: https://hdl.handle.net/11858/00-001M-0000-0019-6618-C

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