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Journal Article

New adhesion promoters for copper leadframes and epoxy resin

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Müller, R., Heckmann, K., Habermann, M., Paul, T., & Stratmann, M. (2000). New adhesion promoters for copper leadframes and epoxy resin. Journal of Adhesion, 72(1), 65-83. doi:10.1080/00218460008029268.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0019-71D4-B
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