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Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings

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Zitation

Dehm, G., Wörgötter, H. P., Cazottes, S., Purswani, J. M., Gall, D., Mitterer, C., et al. (2009). Can micro-compression testing provide stress–strain data for thin films? A comparative study using Cu, VN, TiN and W coatings. Thin Solid Films, 518(5), 1517-1521. doi:10.1016/j.tsf.2009.09.070.


Zitierlink: http://hdl.handle.net/11858/00-001M-0000-0024-4737-6
Zusammenfassung
Micro-compression testing using an instrumented micro- or nanoindenter equipped with a flat punch is a promising approach to measure the stress–strain response of miniaturized materials and to complement hardness and modulus measurements gained by nanoindendation. Focussed ion beam milling is employed to fabricate micron-sized compression pillars from 1 μm thick single crystal Cu(001), TiN(001), and VN(001) films grown on MgO(001), and from a 6.7 μm thick polycrystalline W coating deposited on Si(001). In situ micro-compression tests in a scanning electron microscope reveal reproducible stress–strain curves for W, a considerable statistical scatter in the flow stress for Cu and VN, and failure of TiN pillars by cleavage. A linear work-hardening rate of 2.7±1.2 GPa is determined for the polycrystalline W coating. The results are critically discussed taking into account material defects and the stiffness of the film-substrate system.