Methodology for studying strain inhomogeneities in polycrystalline thin films 
during in situ thermal loading using coherent x-ray diffraction

Vaxelaire, N.; Proudhon, H.; Labat, S.; Kirchlechner, C.; Kečkéš, J.; Jacques, V.; Ravy, S.; Forest, S.; Thomas, O.

doi:10.1088/1367-2630/12/3/035018

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Methodology for studying strain inhomogeneities in polycrystalline thin films during in situ thermal loading using coherent x-ray diffraction

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Citation

Vaxelaire, N., Proudhon, H., Labat, S., Kirchlechner, C., Kečkéš, J., Jacques, V., et al. (2010). Methodology for studying strain inhomogeneities in polycrystalline thin films during in situ thermal loading using coherent x-ray diffraction. New Journal of Physics, 12: 035018, pp. 1-12. doi:10.1088/1367-2630/12/3/035018.

Cite as: https://hdl.handle.net/11858/00-001M-0000-001A-24C1-9

Abstract

Coherent x-ray diffraction is used to investigate the mechanical properties of a single grain within a polycrystalline thin film in situ during a thermal cycle. Both the experimental approach and finite element simulation are described. Coherent diffraction from a single grain has been monitored in situ at different temperatures. This experiment offers unique perspectives for the study of the mechanical properties of nano-objects.