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Micromechanical investigation of solder joints for automotive microelectronics

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Philippi,  Bastian
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria;

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Dehm,  Gerhard
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of solder joints for automotive microelectronics. Poster presented at Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0023-C35D-5
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