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Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading

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Marx,  Vera Maria
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Toth, F., Wiesinger, A., Cordill, M. J., Marx, V. M., & Rammerstorfer, F. G. (2014). Computational simulation of cracking and buckling of thin metallic films on polymer substrate under tensile loading. Talk presented at "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben. Leoben, Austria. 2014-04-10 - 2014-04-11.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0024-A2A2-F
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