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Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects

MPS-Authors
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Balden,  M.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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Linsmeier,  Ch.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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Wiltner,  A.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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Citation

Gao, L., Gstöttner, J., Emling, R., Balden, M., Linsmeier, C., Wiltner, A., et al. (2004). Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Microelectronic Engineering, (76), 76-81.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0027-22EE-D
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