Deutsch
 
Hilfe Datenschutzhinweis Impressum
  DetailsucheBrowse

Datensatz

DATENSATZ AKTIONENEXPORT

Freigegeben

Zeitschriftenartikel

Growth of metal newborn formations on cathode surface under influence of plasma flow

MPG-Autoren
/persons/resource/persons108730

Bobkov,  V. V.
Technology (TE), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons108730

Bobkov,  Vl. V.
Technology (TE), Max Planck Institute for Plasma Physics, Max Planck Society;

Externe Ressourcen
Es sind keine externen Ressourcen hinterlegt
Volltexte (beschränkter Zugriff)
Für Ihren IP-Bereich sind aktuell keine Volltexte freigegeben.
Volltexte (frei zugänglich)
Es sind keine frei zugänglichen Volltexte in PuRe verfügbar
Ergänzendes Material (frei zugänglich)
Es sind keine frei zugänglichen Ergänzenden Materialien verfügbar
Zitation

Bobkov, V. V., Alimov, S. S., Bobkov, V. V., Slyusarenko, Y. V., & Starovoitov, R. I. (2003). Growth of metal newborn formations on cathode surface under influence of plasma flow. Surface and Coatings Technology, 174-175, 1271-1275. Retrieved from http://www.sciencedirect.com/science?_ob=MImg&_imagekey=B6TVV-490H26K-1-G&_cdi=5544&_orig=browse&_coverDate=10%2F31%2F2003&_sk=998259999&view=c&wchp=dGLbVzz-zSkzV&_acct=C000007558&_version=1&_userid=100196&md5=2f92687854ff859215834663834e0f4c&ie=f.pdf.


Zitierlink: https://hdl.handle.net/11858/00-001M-0000-0027-3D20-0
Zusammenfassung
The article presents results of the experimental studies and theoretical description of processes that occur during modification of a Cu cathode surface in the magnetron discharge in Ar. The experimentally observed cone-like microprotrusions are classified and possible mechanisms responsible for the growth of such formations with dimensions in the range 1–100 m are discussed. An analytical model is proposed for the experimentally observed phenomena of growth of the cone-like microprotrusions. We consider the case when a strong electric field in the cathode sheath of the discharge is taken into consideration during sputtering.