Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with 
Copper-Coated Interfaces

Du, J.; Höschen, T.; Rasinski, M.; You, J. H.

doi:10.1016/j.msea.2009.10.046

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Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces

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Du, J.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons109412

Höschen, T.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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Rasinski, M.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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You, J. H.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

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Du, J., Höschen, T., Rasinski, M., & You, J. H. (2010). Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces. Materials Science and Engineering A, 527(6), 1623-1629. doi:10.1016/j.msea.2009.10.046.

Cite as: https://hdl.handle.net/11858/00-001M-0000-0026-EEE1-7

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