Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with 
Copper-Coated Interfaces

Du, J.; Höschen, T.; Rasinski, M.; You, J. H.

doi:10.1016/j.msea.2009.10.046

アイテム詳細

登録内容を編集ファイル形式で保存

一時保存へ追加

タグ情報を表示リリース履歴を表示詳細要約

公開

学術論文

Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces

MPS-Authors

/persons/resource/persons108985

Du, J.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons109412

Höschen, T.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons130844

Rasinski, M.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons110851

You, J. H.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

External Resource

There are no locators available

Fulltext (restricted access)

There are currently no full texts shared for your IP range.

フルテキスト (公開)

Du_Interfacial.pdf
(全文テキスト（全般）), 572KB

付随資料 (公開)

There is no public supplementary material available

引用

Du, J., Höschen, T., Rasinski, M., & You, J. H. (2010). Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces. Materials Science and Engineering A, 527(6), 1623-1629. doi:10.1016/j.msea.2009.10.046.

引用: https://hdl.handle.net/11858/00-001M-0000-0026-EEE1-7

要旨

要旨はありません