English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT

Released

Poster

Improving lead-free solders by resolving mechanical properties at the microstructure length scale

MPS-Authors
/persons/resource/persons125314

Philippi,  Bastian
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125219

Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons75388

Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

External Ressource
No external resources are shared
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Philippi, B., Kirchlechner, C., Schießl, A., Schingale, A., & Dehm, G. (2014). Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Poster presented at Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0023-C731-3
Abstract
There is no abstract available