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Effect of thiol self-assembled monolayers and plasma polymer films on dealloying of Cu–Au alloys

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Pareek,  Aparna
Interface Structures and High-Temperture Reactions, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Ankah,  Genesis Ngwa
Corrosion, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Cherevko,  Serhiy
Electrocatalysis, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Ebbinghaus,  Petra
Interface Spectroscopy, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Mayrhofer,  Karl Johann Jakob
Electrocatalysis, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Erbe,  Andreas
Interface Spectroscopy, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Renner,  Frank Uwe
Interface Structures and High-Temperture Reactions, Interface Chemistry and Surface Engineering, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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引用

Pareek, A., Ankah, G. N., Cherevko, S., Ebbinghaus, P., Mayrhofer, K. J. J., Erbe, A., & Renner, F. U. (2013). Effect of thiol self-assembled monolayers and plasma polymer films on dealloying of Cu–Au alloys. RSC Advances, 3(18), 6586-6595. doi:10.1039/c3ra22970j.


引用: https://hdl.handle.net/11858/00-001M-0000-0027-D682-4
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