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Application of a diffusion bonding methodology to develop a B/Cu HIP bond suitable for the ITER blanket

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Sherlock, P., Erskine, A., Lorenzetto, P., Peacock, A., & et al. (2003). Application of a diffusion bonding methodology to develop a B/Cu HIP bond suitable for the ITER blanket. Fusion Engineering and Design, 66-68, 425-429.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0028-D494-A
Abstract
Due to its low atomic mass and high thermal conductivity beryllium is a candidate plasma facing material for the ITER primary first wall (PFW). HIP bonding and brazing have been used previously to bond beryllium tiles to the copper alloy heatsink