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Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures

MPS-Authors
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Raghavan,  Rejin
Synthesis of Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Harzer,  Tristan Philipp
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Djaziri,  Soundès
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Philippi,  Bastian
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Jaya,  Balila Nagamani
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Raghavan, R., Wheeler, J. M., Harzer, T. P., Chawla, V., Djaziri, S., Thomas, K. V., et al. (2015). Transition from shear to stress-assisted diffusion of copper–chromium nanolayered thin films at elevated temperatures. Acta Materialia, 100, 73-80. doi:10.1016/j.actamat.2015.08.016.


Cite as: http://hdl.handle.net/11858/00-001M-0000-0029-6A63-F
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