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Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu

MPS-Authors
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Raghavan,  Rejin
Synthesis of Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Harzer,  Tristan Philipp
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Djaziri,  Soundès
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Hieke,  Stefan Werner
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Raghavan, R., Harzer, T. P., Djaziri, S., Hieke, S. W., Kirchlechner, C., & Dehm, G. (2017). Maintaining strength in supersaturated copper–chromium thin films annealed at 0.5 of the melting temperature of Cu. Journal of Materials Science, 52(2), 913-920. doi: 10.1007/s10853-016-0386-6.


Cite as: https://hdl.handle.net/11858/00-001M-0000-002D-8EDE-F
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